 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uWoeT-0000CdC; Thu, 20 Jun 96 13:40 CDT |
| Old-Return-Path: |
|
| Date: |
Thu, 20 Jun 96 11:45:07 PST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Fri Jun 21 08: |
58:28 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"7eWrc3.0.pV8.LiPon"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Please forgive my ignorance, but what are the undesireable effects
from not baking aramid material prior to assembly?
[log in to unmask]
|
|
|
