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41:33 1996 |
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Hello Neal - OSPs are not OSPs! There are several products available
on the market and they all have various degrees of thermal excursion
durability. The type of reflow environment (nitrogen or not) and
cleaning system (for say a double pass assembly that gets cleaned
between reflow passes) are factors to consider too. Send an email on
which specific OSP you are using and we can discuss.
Dave Hillman
Rockwell Collins
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Subject: Assembly: OSP and Bake.
Author: [log in to unmask] at ccmgw1
Date: 6/18/96 7:15 PM
Anyone pre-baking prior to the wave with OSP on the boards. Time and
Temp? Seems I heard about an oxidation of the Cu under the OSP, or
was the T & T too much? Question comes up because of the necessity to
bake things such as Thermount boards prior to any temp. stressing.
Thanks, Neal Preimesberger, HMSC Tucson. 520-794-1030
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