TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uWTXl-0000DAC; Wed, 19 Jun 96 15:08 CDT
Encoding:
24 Text
Old-Return-Path:
Date:
Wed, 19 Jun 96 15:12:28 cst
Precedence:
list
Resent-From:
Cc:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/4762
From [log in to unmask] Fri Jun 21 08:
41:09 1996
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"RsrXA3.0.Po9.Vu5on"@ipc>
Subject:
From:
"ddhillma" <[log in to unmask]>
X-Loop:
Resent-Sender:
TechNet-request [log in to unmask]
Message-Id:
Parts/Attachments:
text/plain (27 lines)
     Try:
     
     "Assembly Induced Defects" AVX Corporation Technical Information 
     #AIND8895-R, author J. Maxwell
     
     "Design and Processing Problems in Soldering Surface Mount Chip 
     Capacitors and Resistors", EXPO SMT, 1987, pg. 37-48.
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: PWB flexing and SMT components
Author:  [log in to unmask] at ccmgw1
Date:    6/18/96 4:37 PM


     
Does anyone have any good references on flexing of printed wiring boards and 
surface mount component (chip) fracturing?
     



ATOM RSS1 RSS2