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Hi Suzanne
The only references found to date is the ANSI/J-STD-001 Joint Industry
Standard. Under section 9.0 Assembly Requirements their is a Bow and
Twist(Warpage) specification 9.2.3.
If you find something else please let me know. Hope this helps..
Does anyone have any good references on flexing of printed wiring boards
and
surface mount component (chip) fracturing?
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