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Although J-STD-001 (revisions A and B) states that assemblies should be
preheated prior to exposure MOLTEN solder. (It doesn't mention reflow.)
It further states: "The preheat temperature must not degrade printd
boards, components, or soldering performance."
Obviously, the process for prebake is assumed to be site-specific.
Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Tue, 18 Jun 1996, teik wrote:
> A customer of ours is asking what is the best practice baking
> procedure (or pre-conditioning) of loaded board prior to IR reflow or
> wave soldering.
>
> All of our specs in house deal with bare boards. I know there must be
> an IPC assy spec that specifies boards pre-conditioning at reflow. Can
> someone tell me the spec#, temperature and duration?
>
> Thanks.
>
> Teik M. Ng
> [log in to unmask]
> PC World
> Toronto, Canada
>
>
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