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From [log in to unmask] Tue Jun 18 13: |
59:25 1996 |
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<"M3Syn.0.kmK.1mlnn"@ipc> |
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Jeff,
HOWZITGOIN?
Jeff Seeger wrote:
> I'm looking for empirical advice on thermal relief sizing. The
> IPC 275 answer is a maximum copper attach of .160 or .080 (1 or 2
> oz cu), fine for loads but not sufficient for the supply side.
>
> The application is a pressfit backplane with an intended (oof)
> fountain soldered power connector. Problem with power connectors
> of late is that we're up to 10 amperes/pin, or to put it another
> way, ~twice the max recommended thermal connection.
>
> On these particular backplanes there are also reflowed discrete
> components. None of the manufacturers we're working with are
> using intrusive reflow yet. (hint, hint?)
>
> Is anyone having repeatable success using any other guideline?
> The IPC 275 answer does not mention specific soldering process
> but would presumably cover wave. Will long-and-slow fountain
> techniques suffice? To make matters worse, not every pin on the
> connector has so much load (or copper).
>
Typically, we put a thermal on the thru-hole pin and then we
also run fat trace(s) to as many vias as required. Each via
is "flooded" to the plane (no thermal relief).
Thank you and have a FANTASTIC day!
Kevin L. Seaman (714) 221-4752
P.S. If your "reply" bounces back, then "send" to:
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