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Mon, 17 Jun 1996 11:23:19 -0500 |
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| From [log in to unmask] Mon Jun 17 14: |
34:25 1996 |
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Presently we are seeing accurrances of solder splashes in our wave solder
process. We have PCB's that are less then three months old and our storage
process is inside of a ziplock bag with desiccant. Our present environment
has a higher than normal humidity level of 40 to 50%. We have attempted
many adjustments to the proces such as speed, flux gravity(foamer), etc..
The only thing that appears to eliminate or reduce the splashes is baking
the assembly for 1 hour at 50 degrees 'C' and doing the wave process while
the assembly is still hot.
Does anyone out there have any ideas of what could cause this problem or
things we should try that could eliminate them?
Thanks in advance
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