TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uUeVu-0000CXC; Fri, 14 Jun 96 14:26 CDT
Old-Return-Path:
Date:
Fri, 14 Jun 1996 14:14:06 +600 CDT
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
Priority:
normal
TO:
Return-Path:
<TechNet-request>
X-Loop:
X-Mailing-List:
<[log in to unmask]> archive/latest/4685
X-Mailer:
Pegasus Mail for Windows (v2.23)
Resent-Message-ID:
<"oeQv31.0.iWF.epRmn"@ipc>
Subject:
From:
"John Gully" <[log in to unmask]>
From [log in to unmask] Fri Jun 14 18:
36:29 1996
X-Confirm-Reading-To:
"John Gully" <[log in to unmask]>
Organization:
CompuRoute, Inc.
Message-Id:
Parts/Attachments:
text/plain (15 lines)
Address,

I am looking for sound information regarding the land pattern  
of PBGA and CBGA components, specific to bareboard fabrication.  
I have contacted several sources (Motorola, IBM, etc.) and looking 
for more info.  IPC-SM-782 does not cover this type of component 
geometry.  Has IPC developed or revised -782 to include BGA land
patterns?  If so, I need a copy. All sources of information are 
welcomed.  Thank you.

John Gulley  - PE
Dallas, TX



ATOM RSS1 RSS2