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Martin,
We use the following for process monitoring:
________________________________________________________
BGA Site X-Ray Inspection Standards/Criteria
Ref. 9/28/95
1. Maximum 25 percent of BGA joint area can be voids.
2. Maximum void diameter is 30 percent of BGA joint area
diameter.
Regards,
Karl Sauter
Staff Engineer - PWBs
Sun Microsystems, Inc.
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