 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uRpC7-0000CBC; Thu, 6 Jun 96 19:14 CDT |
| Old-Return-Path: |
|
| Date: |
Thu, 6 Jun 1996 20:20:52 -0400 |
| Precedence: |
list |
| X-Loop: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Fri Jun 7 10: |
25:12 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"X1AFT1.0.9_C.YHtjn"@ipc> |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| Message-ID: |
|
| Parts/Attachments: |
|
|
We agree with Delsen. We have done a lot of
thermal shock testing of vias with and without
plugs.
Holes with good plating do not crack.
Holes with not so good plating crack.
It is has never appeared to be a function of solder
mask plugs
Susan Mansilla
Robisan Lab
317-353-6249
|
|
|
