TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tfqpV-0000PNC; Fri, 26 Jan 96 10:16 CST
Encoding:
537 Text
Old-Return-Path:
Date:
Fri, 26 Jan 96 11:20:48 EST
Precedence:
list
X-Loop:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/2388
TO:
Return-Path:
Resent-Message-ID:
<"6JATm2.0.pi4.kvF2n"@ipc>
Subject:
From:
From [log in to unmask] Wed Jan 31 11:
03:35 1996
Resent-From:
Message-Id:
Parts/Attachments:
text/plain (25 lines)
     Mike,
     
        Call them direct @ (516) 436-5200.
     
     Dave Hoover


______________________________ Reply Separator _________________________________
Subject: COMPOSITECH
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    1/25/96 5:14 PM


Can anyone supply information regarding a material named "Compositech".  
I am unfamiliar with the tradename, but it appears to be a method of 
achieving distributed capacitance.
     
Michael Bailey
Director of Engineering
McCurdy Circuits Inc.
     
     



ATOM RSS1 RSS2