 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uR0qa-0000C4C; Tue, 4 Jun 96 13:28 CDT |
| Old-Return-Path: |
|
| Date: |
Tue, 04 Jun 96 14:28:28 EST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"b738n.0.MYF.Z18jn"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Wed Jun 5 17: |
22:06 1996 |
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Hello All those in Technet,
I am in dire need of information concerning gold plating
specifications. I am researching two processes gold flash and gold
plating and would like to know if there are any articles or sources
that will shed any light to these two different processes. I do know
that gold flash is a less expensive approach than plating, but I would
like to know all draw backs to it. Any information will be greatly
appreciated.
Thanks,
Mike
[log in to unmask]
|
|
|
