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| From [log in to unmask] Wed Jun 5 17: |
14:13 1996 |
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Any experience out there with processing Getek material?
Specifically:
- Can positive etchback be achieved with sodium permanganate
(i.e., without plasma or chromic)?
- Is it compatible with both EDTA and DMAB-based oxides?
- How critical is the published "6-9 deg.F uniformly through the
press book" heat rise?
- How repeatable are raw laminate shrinkage factors? (similar to FR4
or drastic like polyimide)
- What post-drill bake, if any, is required prior to etchback?
- Any problems with this bake degrading the oxide adhesion?
- Any success stories with direct metallization?
- Is gassing at desmear & electroless more,less or the same as FR4s.
Designers:
- What's the driving force for this genre of material?
- Is it just Dk and dissipation factor or is there something more?
- Is Neltec's N4000-13 (non-PPO mat'l) a true equivalent?
- Are there any others?
- Is this where the board industry is going?
Lots of questions, hoping for some answers.
Thanks in advance.
J. Felts
PC World, Toronto
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