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by ipc.org (Smail3.1.28.1 #2)
id m0uPBDA-0000CaC; Thu, 30 May 96 12:08 CDT |
| From [log in to unmask] Wed Jun 5 16: |
08:01 1996 |
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Thu, 30 May 1996 13:14:07 +0500 |
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I am looking for placement restrictions for a double sided reflow board. What
co
mponents can and can not be placed on the bottom side. Our concern is the
larger
(heavier) components might fall off during the second pass thru the oven.
Other
than chips and small SO packages we have little experience. New and smaller
designs are pushing us toward larger components on the bottom side. Any and
all comments welcome.
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