 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uOkxF-0000CoC; Wed, 29 May 96 08:06 CDT |
| From [log in to unmask] Wed Jun 5 12: |
15:08 1996 |
| Old-Return-Path: |
|
| Date: |
29 May 1996 08:12:34 CDT |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"BrBKN1.0.FtC.Gl4hn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
To: [log in to unmask]
Subject: Re: FAB: Silk-screen ink on surface mount pads
.ddn adtran.com(JIME)
I agree that the designer should make the pattern easier for the PCB
manufacturer. I support the legend ink area and we see lots of artwork
around components and near pads that do not need to be there. After a negative
merge, some of the nomenclature is missing. The process of silk screening is
not a high tolerance process. If only the needed nomenclature is supplied, and
boxes and foot prints are left. The silk screen process should be easier and
cheaper.
Frank H. Barrow (FBARROW)AUSVMR [log in to unmask]
Sr. Associate Engineer
Austin TL 678-6743
*** Reply to note of 05/29/96 07:57
|
|
|
