TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uMgpm-0000EVC; Thu, 23 May 96 15:18 CDT
CC:
Old-Return-Path:
Date:
Thu, 23 May 1996 16:24:08 -0400 (EDT)
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/4314
From [log in to unmask] Wed Jun 5 11:
13:35 1996
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"IC_fm.0.m_G.1WCfn"@ipc>
Subject:
From:
CINDY KEMP ORLANDO ISC 8*826-6873 <[log in to unmask]>
X-Loop:
Message-Id:
Parts/Attachments:
text/plain (24 lines)
Jack Tippit wrote:

We have instances where tin/lead coated pins are inserted into gold plated 
sockets, etc.  Components even have gold/tin-lead or gold/tin interfaces, 
such as an IC socket with a gold contact with a tin sleeve.  Mil-Std-889B 
indicates gold as being incompatable with tin or tin/lead.  Has anyone 
looked into this issue and is there a potential for corrosion formation and 
associated problems?  Again, I just refereing to mechanical contact ( not 
soldering ).

WE HAVE HAD A PROBLEM WHERE A PIN GRID ARRAY PART THAT HAD GOLD LEADS CAME IN 
SOLDER DIPPED AND WHEN INSERTED INTO THE GOLD SOCKET, DEVELOPED FAILURES IN THE	
FIELD THAT OUR FAILURE ANALYSIS CONTRIBUTED TO "FRETTING CORROSION".  WE HAD A 
LARGE QUANTITY OF THESE PGA ASIC'S, SO HAD TO MODIFY THE ASSEMBLY PROCESS TO USE 
THEM UP; NOT EXPOSE TO FLUX, MOISTURE, ADD BAKING STEPS, ETC.  

CINDY KEMP
LOCKHEED MARTIN CORP.
ORLANDO, FL
407-826-6873 




ATOM RSS1 RSS2