Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uMcLu-0000F4C; Thu, 23 May 96 10:31 CDT |
Old-Return-Path: |
|
Date: |
Thu, 23 May 1996 11:37:08 -0400 |
Precedence: |
list |
Resent-From: |
|
From [log in to unmask] Wed Jun 5 10: |
59:42 1996 |
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"HnzgT1.0.QqE.jI8fn"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Message-ID: |
|
Resent-Sender: |
|
Parts/Attachments: |
|
|
The formation of a corrosion product wit tin-lead/gold requires some
environmental condition such as moisture or perhaps oxygen. I have examine
solder plug-ins to gold connectors after 3 years and saw no signs of fretting
or corrosion; however, the environment was dry and kept dry. In other cases
the environmet was dry nitrogen and the connections looked exactly like they
they did when they were connected.
Phil Hinton
[log in to unmask]
|
|
|