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| From [log in to unmask] Wed Jan 31 10: |
36:45 1996 |
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yes, gold does alloy with tin and lead: Au6Sn, AuSn, AuSn2, AuSn4, & Au2Pb
(from table in H. Manko's book Solders and Soldering)
______________________________ Reply Separator _________________________________
Subject: Re: Sn-Pb etch
Author: [log in to unmask] at corp
Date: 1/25/96 5:42 AM
As far as gold is concerned, doesn't the gold alloy into the solder. If so
the gold "underlying intermetallics" are already touched. This might
explain the gold re-precpitating, since it won't go into an HCl solution.
>Subject: Sn-Pb etch
>Author: [log in to unmask] at corp
>Date: 1/24/96 10:58 AM
>
>
>Can anyone recommend a method to completely remove the 63-37 solder from a
>surface, leaving the underlying intermetallics untouched? I have tried
>hydrochloric acid; it works for solder reflowed on Cu, but in joints with
>gold it apparently re-precipitates gold artifacts. Any help would be
>greatly appreciated.
>
>Edwin Bradley
>Motorola
>
;;;
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