 
| X400-Content-Type: |
P2-1988 ( 22 ) |
| Old-Return-Path: |
|
| Date: |
16 May 1996 12:05:11 -0500 |
| X-Status: |
|
| From [log in to unmask] Thu May 16 13: |
48:05 1996 |
| Resent-From: |
|
| Conversion: |
Allowed |
| Disclose-Recipients: |
Prohibited |
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| Priority: |
normal |
| Precedence: |
list |
| X-Loop: |
|
| Content-Return: |
Allowed |
| X400-MTS-Identifier: |
[/c=US/admd=MCI/prmd=Honeywell/; 00ED1319B6047F5A-HW-MTA-AZ] |
| TO: |
|
| X-Mailing-List: |
|
| Return-Path: |
<TechNet-request> |
| Message-Id: |
<00ED1319B6047F5A*/c=US/admd=MCI/prmd=Honeywell/o=AZ-MTA/ou=MSMail/ou=CAS/s=Edwards/g=Ted/i=A/@MHS> |
| X400-Recipients: |
non-disclosure; |
| X400-Originator: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uK6P8-00008hC; Thu, 16 May 96 11:59 CDT |
| Resent-Message-ID: |
<"O5Ope2.0.OjD.Eyrcn"@ipc> |
| Subject: |
|
| From: |
|
| Alternate-Recipient: |
Allowed |
| X400-Received: |
by /c=US/admd=MCI/prmd=Honeywell/; converted ( IA5-Text);
Relayed; 16 May 1996 12:05:11 -0500
by mta HW-MTA-AZ in /c=US/admd=MCI/prmd=Honeywell/; converted (
IA5-Text); Relayed; 16 May 1996 12:05:11 -0500 |
| Original-Encoded-Information-Types: |
IA5-Text |
| Content-Identifier: |
00ED1319B6047F5A |
| Parts/Attachments: |
|
|
We procure microwave boards that to IPC-HF-318 would be Class 3 Type 3.
Recently we see some suppliers having problems which result in plating
voids. The criteria for voids in a plated through hole are defined but
voids in the plated edges of the board do not seem to be defined anywhere.
Question 1. A void across an interconnect in a normal multilayer is
real bad but what about a void across the same interconnect when it is a
ground that goes all the way around the periphery of the finished board?
Question 2. Does anybody know where plated edge requirements are
listed?
Question 3. Since I can not find what I am looking for in a
specification, if no specification exists, does anybody have criteria?
Thanks
[log in to unmask]
|
|
|
