Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tf9eD-0000PGC; Wed, 24 Jan 96 12:10 CST |
Old-Return-Path: |
|
Date: |
24 Jan 96 12:13:24 -0600 |
Precedence: |
list |
X-Loop: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"bQaCE.0.Op8.6Od1n"@ipc> |
Subject: |
|
From: |
|
Resent-From: |
|
From [log in to unmask] Wed Jan 31 10: |
15:39 1996 |
Message-Id: |
<"Macintosh */PRMD=MOT/ADMD=MOT/C=US/"@MHS> |
Parts/Attachments: |
|
|
Can anyone recommend a method to completely remove the 63-37 solder from a
surface, leaving the underlying intermetallics untouched? I have tried
hydrochloric acid; it works for solder reflowed on Cu, but in joints with
gold it apparently re-precipitates gold artifacts. Any help would be
greatly appreciated.
Edwin Bradley
Motorola
|
|
|