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| From [log in to unmask] Wed May 15 19: |
37:28 1996 |
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What direction is the question slated toward? Are you worrying about
diffusion of the copper into the gold? Are you concern about cracking
of the nickel under stress? What is the application? Please fill in
some more details!
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Electroless Nickel
Author: [log in to unmask] at ccmgw1
Date: 5/9/96 9:00 PM
We are looking for testing which has been done to determine the
minimum electroless nickel thickness to be used as a barrier layer
between copper and gold. Please respond with data.
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