Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uHocX-00008ZC; Fri, 10 May 96 04:36 CDT |
Old-Return-Path: |
|
Date: |
Fri, 10 May 96 10:37:48 BST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"wvEjE2.0.ndE.Luman"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Wed May 15 19: |
36:33 1996 |
X-Loop: |
|
Cc: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
Hi Steve,
You may find that the low humidity will lead to a significant risk of
ESD damage to your parts, as well as rather uncomfortable working
conditions for your people.
Richard L. Shook and co-workers published an excellent paper on
Moisture Absorption/desorption rates at last years ECTC:
Richard L. Shook et al: Diffusion Model to derate Moisture Sensitive Surface
Mount ICs for Factory Use Conditions, pp440 - 449; 45th Electronics Components
& Technology Conference, Las Vegas, 1995.
His data is particularly valuable (and re-assuring)for operations in
which a bag is opened and closed daily, in which an effective dessicant
is included.
I hope that this helps you.
Tom Moore,
Package Development, Analog Devices B.V., Ireland.
|
|
|