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by ipc.org (Smail3.1.28.1 #2)
id m0uHfN6-0000CeC; Thu, 9 May 96 18:43 CDT |
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Thu, 09 May 96 17:09:47 PST |
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<TechNet-request> |
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| From [log in to unmask] Wed May 15 19: |
31:47 1996 |
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We are looking for testing which has been done to determine the
minimum electroless nickel thickness to be used as a barrier layer
between copper and gold. Please respond with data.
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