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From [log in to unmask] Wed May 15 19: |
18:01 1996 |
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Remembering from a prior life, we used to do 5 solder shocks, standard
Mil-P-55110C (the revision in force at the time) sample conditioning and
preparation. The solder shock was a float at 550 deg.F. for 10 seconds.
Product used was random selection from what was being manufactured on the
floor at the time. This regimen was used as a process control and was done
daily. If the process did not pass 3 or more solder shocks, we would react
and go start looking at the contributing process variables (i.e. copper bath
condition, laminates used, Z-Axis, ductility, elongation, baking processes
etc.). The actual product reject criteria, however, still remained that the
product had to pass 1 solder shock, as in the military specification
pertaining at the time.
Hope this helps.
Greg Schroeder
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______________________________ Reply Separator _________________________________
Subject: In-process Test coupons
Author: [log in to unmask] at SMTPLINK-HADCO
Date: 5/8/96 8:36 PM
Does anybody pull coupons immediately after pattern plate and solder float
the coupons as an inprocess check? If so how many floats and at what
temperature: the usual 550F? If mutiple floats are used what reject
criteria is used?
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