Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Wed, 8 May 96 18:22 EST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
X-Loop: |
|
Resent-Message-ID: |
<"WmmnM1.0.eIF.LmIan"@ipc> |
Subject: |
|
From: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uHIWN-0000FqC; Wed, 8 May 96 18:19 CDT |
Message-Id: |
|
X-Mailer: |
Windows Eudora Light Version 1.5.2 |
From [log in to unmask] Wed May 15 18: |
33:56 1996 |
Parts/Attachments: |
|
|
Does anybody pull coupons immediately after pattern plate and solder float
the coupons as an inprocess check? If so how many floats and at what
temperature: the usual 550F? If mutiple floats are used what reject
criteria is used?
|
|
|