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| From [log in to unmask] Wed May 15 18: |
19:13 1996 |
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Occasionally with Teflon base material boards adhesion of a pad or run
is lost during assembly, especially with connectors and larger parts which
require more heat, and we are wondering if anyone has experience in rework
or repair to reattach pads or runs to Teflon boards. We would like bond
strength in the range of original and without microwave performance
degradation. Anybody got any ideas or suggestions?
Thanks
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