TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Wed, 8 May 1996 10:10:28 -0400
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/3932
X-Sender:
gary@gateway
TO:
[log in to unmask] (Guenter Grossmann)
Return-Path:
<TechNet-request>
X-Loop:
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uHAcp-00008hC; Wed, 8 May 96 09:53 CDT
Resent-Message-ID:
<"hjQlM.0.qIF.5MBan"@ipc>
Subject:
From:
Gary Ferrari <[log in to unmask]>
Cc:
Message-Id:
X-Mailer:
Windows Eudora Light Version 1.5.2
From [log in to unmask] Wed May 15 18:
11:29 1996
Parts/Attachments:
text/plain (29 lines)
Guenter;

You should be able to apply the concepts of IPC-SM-782 to any component
regardless of the soldering process.

At 12:31 PM 5/8/96 +0200, Guenter Grossmann wrote:
>Garry
>
>Thank you very much for your hint. I do work with IPC-SM-782A but I thought
>that this spec. only applies to components with wettable terminations
>touching the solder wave. Are you sure I can use it also for components
>with terminations that are so small that the wave has to touch the solder
>land in order to form a solder joint?
>
>Best regards
>
>Guenter
>
>
>
Regards,

Gary Ferrari
Tech Circuits
(203)269-3311
[log in to unmask]



ATOM RSS1 RSS2