The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic is Component
Mounting.

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          114  Which characteristics impact solder joint integrity
          for surface mount parts?
          
          A.   the land pattern design
          B.   the land pattern position
          C.   the land pattern selection
          D.   the shape of the component lead
          E.   the size of the component termination
          F.   the height of the component from the board
          G.   the distance between adjacent land patterns

                         select the three most correct answers

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Previous QOD

          113 Which side of the board should through-hole
          components be mounted on, if the board is to be machine
          (wave) soldered?
         
          D.   the side opposite that which is in contact with   
               the solder
                              
Resource: IPC-T-50 Specific Terms and IPC-D-275 para 4.1.1;
figure 4-1.

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Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman