DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0u21bu-00008pC; Wed, 27 Mar 96 14:14 CST
Content-Type:
TEXT/PLAIN; charset=US-ASCII
Old-Return-Path:
<willli>
Date:
Wed, 27 Mar 1996 14:14:22 -0600 (CST)
Precedence:
list
Resent-From:
[log in to unmask]
cc:
[log in to unmask]
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/1500
TO:
[log in to unmask]
Return-Path:
<DesignerCouncil-request>
X-Status:
Resent-Message-ID:
<"53Vx-.0.WZ9.W6QMn"@ipc>
Subject:
DES. (fwd)
From:
Lisa Williams <[log in to unmask]>
X-Loop:
[log in to unmask]
From [log in to unmask] Thu Mar 28 11:
16:53 1996
Message-ID:
<Pine.3.89.9603271457.D68709-0100000@ipc>
Resent-Sender:
DesignerCouncil-request [log in to unmask]
Parts/Attachments:
TEXT/PLAIN (28 lines) 


---------- Forwarded message ----------
Date: Tue, 19 Mar 96 09:32 EST
From: Mike Cussen <[log in to unmask]>
To: [log in to unmask]
Subject: DES.


 The layout group wanted me to ask the TechNet group this question.

 We are in the process of designing a circuit board that will be two 
 layers, SMT, and FR4 material. We have one SO8 package that will be getting
 a bit warm due to the design. One side of this SO8 package, has four
 pins of the same net, the designer would like to tie all these pads to one
 large ground pad. They are concerned about thermal relief and the reflow 
 process. What kind of problems may we have?

 Michael Cussen
 Medar Inc.
 [log in to unmask]


 

ATOM RSS1 RSS2