Dear Designers,

Our company is a Contract/Turnkey manufacturer, who is engage 
in PWB assembly as well as Box Build assembly. We are currently
on a study and want to try our Chip on Flex capability. May I
solicit some information about: 
   1. Flex design (for COF application)
                - Type of mat'l
                - Recommendations on adhesive (type)
                - Pad architechture
   2. Critical Parameters (Bonding and Curing process)
   3. Indirect mat'ls rcommendations
                - Die attach epoxy
                - Glob top mat'l

Thank you.
--
Engineering Department
Electronic Assemblies, Inc. - http://www.globe.com.ph/~eai

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