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1996

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The following info was gleaned from...
http://www.automata.com/ipc/forums.htm

Q: What is the correct procedure for subscribing to a forum?

A: Send an e-mail message as follows:

To: <forum>[log in to unmask] 
Subject: subscribe

where <forum> is the name of the forum to which you wish
to subscribe. Do not include text in the body of your e-mail.

FORUMS:

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     The IPC Roadmap forum is the communication vehicle used by members
of the Technical Working Groups (TWGs)
who developed the original IPC National Technology Roadmap for
Electronic Interconnections. The forum is used to keep the activity
moving as a continuous project of improving the data base and analyzing
the status of recommendations for needed research or technology
transfer. Others are encouraged to use the forum to communicate their
input to the roadmap TWGs.  This includes members of other road mapping
teams such as NEMI, SIA, EDAC and others. The Roadmap forum is intended
to provide the opportunity for cohesive information exchange that
facilitates coordinated Roadmap development and updating. 

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     The ComplianceNet forum covers environmental, safety and related
regulations or issues. In addition to giving you a forum for exchanging
problems and solutions with your colleagues and IPC staff in this area,
IPC will provide the following information on ComplianceNet: 

     Regulatory proposals, alerts and draft comments 
     Legislative updates 
     New regulatory interpretations (i.e., photoresist skins) 
     Grass roots action alerts 
     Compliance assistance 

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     This peer networking forum can be used to ask others for technical
help, comments or questions on IPC specifications, or other technical
inquiries. IPC will also use TechNet to announce meetings, important
technical issues, surveys, etc. As a general networking forum, any
technical question is fair game. 

     We suggest that discussion of pricing is not appropriate for
TechNet. Requests for recommendations of products or suppliers are
appropriate when responses are sent to the individual requesting the
information only and not to the entire TechNet forum. 

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     This forum provides a means to stay current with the many programs
of the IPC Designers Council. 
     Those looking for information on upcoming IPC Designers Council
activities, such as the ongoing efforts to establish a certification
exam, should subscribe. Information, comments, and feedback about the
Design Technology Symposium, local chapter meetings, new chapters
forming, or anything else pertaining to the council are all encouraged.
Also, information about national and local meetings is disseminated. 

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     This peer networking forum is very specific. Sign on here to
comment, help or get help on issues relating to ANSI/J-STD-012,
"Implementation of Flip Chip and Chip Scale Technology." 

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     This peer networking forum is very specific. Sign on here to
comment, help or get help on issues relating to IPC-RB-276,
"Qualification and Performance Specification for Rigid Printed Boards." 

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     This peer networking forum is very specific. Sign on here to
comment, help or get help on issues relating to IPC-SM-840,
"Qualification and Performance of Permanent Polymer Coating (Solder
Mask) for Printed Boards." 

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The Electronics Industries Quality Council (EIQC) of North America has
established this forum for the exchange of e-mail messages related to
activities on quality and implementation of the principles of ISO 9000.
They invite you to address all subjects on quality, ISO 9000, or EIQC
business. 

George Uptain - Schlumberger Well Services
512-331-3183
Austin, Texas

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