The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic is Copper
Features..

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          109  What is the most probable cause of a through-hole
          multilayer board assembly repeatedly containing
          defective joints on the power and ground connections?
          
          A.   the solder dwell is too short
          B.   component leads are too large
          C.   the board orientation is incorrect           
          D.   component through-holes are not thermally relieved

                                   select the most correct answer

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Previous QOD

          108  What is the primary purpose for breaking up large
          conductive areas on external layers?
          
                    C.   to prevent solder mask blistering 
                    
     Resource: IPC-T-50 Specific Terms and IPC-D-275 para
5.3.1.5; 5.5.1

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Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman