DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG

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52:15 1996
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We have used it for single sided boards and we found the Z expansion to be 
excessive. I would suspect plating vias would not be very reliable once 
thermal expansion started. I recommend speaking with your board vendors as 
they should have reliable data to go by.		-Ed Current

----------
From: 	Barry Olney[SMTP:[log in to unmask]]
Sent: 	Monday, August 05, 1996 6:41 PM
To: 	[log in to unmask]
Subject: 	CEM1 Substrate material

Has anyone used CEM1 substrate material?  Can CEM1
be plated through?

I believe it is a low cost material that is used
in the mass production of comsumer products.
Holes are punched rather than drilled.

Thank you in advance for your help.
___________________________________________________

Barry Olney		      http://www.icd.com.au
Managing Director			

In-Circuit Design Pty Ltd   	Ph: +61 3 9205 9595
VeriBest Solutions Centre	Fax:+61 3 9205 9410
Suite 211, Princess Tower	Mbl:+61 4 1117 0827
1 Princess Street,				
Kew, VIC 3101, Australia    Email:[log in to unmask]
___________________________________________________

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