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From [log in to unmask] Tue Jul 9 18: |
32:02 1996 |
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We are having a problem with the gold card edge connector
contacts on our boards burring during board edge routing at fab.
This is causing a great deal of hand sanding after the boards
are assembled and removed from the panel. Our contacts use an
external plating strip using the entire contact width (.040).
This was done for 2 reasons: 1) I do not have vias or holes at
every contact (SMT), 2) I do not have any internal signal
layers (2 ext/2 planes). I realize I may have to go to a THT
connector, but would prefer to avoid it.
I pose the following questions:
1) Does anyone do internal plating strips using the plane
layers? If so, could explain exactly how you are doing it.
2) Does anyone use a smaller trace width from the contact to the
external plating strip? If so, what width and is it centered or
offset to one side? Has this caused any peeling or burring
problems?
3) Is your Fab house doing anything special to prevent burring?
4) Has anyone tried scoring along the gold contacts? If so, how
did it work out? Did the contacts burr or did it give an
acceptable edge?
5) Does anyone spec a chamfer along the contact edge of the PCB
on a panelized design? If so, how does it affect cost? What
chamfer was spec'd?
I would like to hear anyone's experiences with gold contacts,
either good or bad. All suggestions are greatly appreciated!
Thanks in advance!
Brandon Luther
Dataram Corp.
Princeton, N.J.
[log in to unmask]
(609) 799-0071 x310
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