What have companies done to address the cracking problem of multi-layer 
cermaic chip capacitors? We see cracking problems with 0.1 and 0.01 
microfarad X7R ceramic caps. The defect is more a mechanical stress crack 
and not a thermal stress crack.

We understand some companies prohibit this type of component from being 
included in product design. Does anyone have ideas how a company can 
successfully use these components? Are there alternative components that 
can be used to replace the X7R capacitor?

Suggestions, comments and horror stories welcomed.

Thanks.   Rick Vernon, Phoeinx International