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1995

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Subject:
From:
"APeder01" <[log in to unmask]>
Date:
04 Dec 1995 11:02:11 EST
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          I know that the use of foil lamination helps increase
          thru-put for inner-layer processing at the PWB fabricator.
          But, from a PWB performance and reliability standpoint, what
          are the pros and cons of foil lamination over a "core"
          stack-up??




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