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1995

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Subject:
High Z Axis Expansion Board Materials
From:
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Date:
Sat, 2 Dec 1995 16:25:21 -0500
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We receive questions about plating high Z axis expansion board materials.
 When the expansion from assembly soldering is too great, surface pads around
the holes lift, or the plated barrel cracks.  Does anyone have a standard
practice to prevent these phenomena when using laminate with great amounts of
 Z axis expansion (we think more than 6%)?

Thicker plating in the hole?
Alternate metals plated?

Dennis Fritz
MacDermid, Inc.
245 Freight Street
Waterbury CT 06702
Phone 203-575-5740

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