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1995

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Subject:
From:
Bill Gaines B160 x2199 <[log in to unmask]>
Date:
Thu, 25 May 95 11:03:18 PDT
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June Dinner Meeting, IEPS Los Angles/Orange Chapter, 7 June 95

          The Orange County Chapter of The
      International Electronics Packaging Society
                     Presents:
                Plastic IC Packaging

Wednesday, 7 June 1995               Holliday Inn Maingate  
              5:00 p.m. - 8:30 p.m.  Harbor Blvd, So of Katella
                                     Anaheim, Ca USA 714-750-2801
Cost: IEPS Members: $12, Nonmembers: $15

The technical program runs from 7:30 P.M. to 8:30 P.M., 

                Plastic IC Packaging
                    Len Enlow                                         
                                         
     o Military/High-rel Applications    
     o Information Gained from Literature
     o Cost                              
     o Failure Modes/Failure Accelerators
     o Advantages of Plastic Packaging   
     o Disadvantages of Plastic Packaging


     Len Enlow, Materials & Process Lab, Rockwell, is currently following 
     and reporting on this topic as a part of his duties at 
     Rockwell Electronis Systems Division, Anaheim. 

     Mr. Enlow is responsible for materials and process development and 
     support for all company electronic programs.  He has over 28 years of 
     electrical design, engineering, and production experience in 
     microelectronic circuits and packaging.  Mr. Enlow has designed circuit
     modules for a broad range of military, space, medical and comercial 
     applications been responsible. He has been responsible for design, 
     layout, simulation, testing and documentation of thin and thich-film 
     hybrids, low-temp. cofired ceramic substrates and multichip modules.  
     
Voice RSVP to: Bob Hausmann IEPS OC/LA Chapter Phone: (714) 779-8086

E-mail RSVP may be directed to [log in to unmask] 
(Bill Gaines, OC-LA IEPS chapter board member)

Please direct e-mail questions about the IEPS OC/LA Chapter to:
Bill Gaines, <[log in to unmask]> m-th 

=====================================================================
Information about the IEPS may be obtained via e-mail at             
            [log in to unmask]                                   
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