June Dinner Meeting, IEPS Los Angles/Orange Chapter, 7 June 95
The Orange County Chapter of The
International Electronics Packaging Society
Presents:
Plastic IC Packaging
Wednesday, 7 June 1995 Holliday Inn Maingate
5:00 p.m. - 8:30 p.m. Harbor Blvd, So of Katella
Anaheim, Ca USA 714-750-2801
Cost: IEPS Members: $12, Nonmembers: $15
The technical program runs from 7:30 P.M. to 8:30 P.M.,
Plastic IC Packaging
Len Enlow
o Military/High-rel Applications
o Information Gained from Literature
o Cost
o Failure Modes/Failure Accelerators
o Advantages of Plastic Packaging
o Disadvantages of Plastic Packaging
Len Enlow, Materials & Process Lab, Rockwell, is currently following
and reporting on this topic as a part of his duties at
Rockwell Electronis Systems Division, Anaheim.
Mr. Enlow is responsible for materials and process development and
support for all company electronic programs. He has over 28 years of
electrical design, engineering, and production experience in
microelectronic circuits and packaging. Mr. Enlow has designed circuit
modules for a broad range of military, space, medical and comercial
applications been responsible. He has been responsible for design,
layout, simulation, testing and documentation of thin and thich-film
hybrids, low-temp. cofired ceramic substrates and multichip modules.
Voice RSVP to: Bob Hausmann IEPS OC/LA Chapter Phone: (714) 779-8086
E-mail RSVP may be directed to [log in to unmask]
(Bill Gaines, OC-LA IEPS chapter board member)
Please direct e-mail questions about the IEPS OC/LA Chapter to:
Bill Gaines, <[log in to unmask]> m-th
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