INTERNATIONAL CONFERENCE ON
ELECTRONIC ASSEMBLY:
Materials and Process Challenges
 
 
Including BGA, Flip Chip
And Other High Density Technologies
 
     May  29, 30, 31, 1996
 
Co-Sponsored by
    Georgia Institute of Technology
    School of Materials Science and Engineering
    Atlanta, Georgia
 
    and
 
    Institute for Interconnecting and Packaging
    Electronic Circuits
 

Call for Abstracts
 
    The International Conference on Electronic Assemby:  Materials and Process
Challenges (including  BGA, Flip Chip and  Other High Density Technologies)
will be held at Georgia Institute of Technology on May 29-31, 1996.
Co-sponsored by the IPC, this international conference is an outgrowth and
expansion of the International Conference on Soldering Flux and Pastes held
every two years at Georgia Tech.
 
    Technology advances are moving beyond fine pitch placement and soldering,
toward ball grid array (BGA) and direct chip attach (DCA).  This requires that
new materials and processes be developed to  interface with and in some case
replace traditional assembly  technology. Suppliers of soldering fluxes and
pastes are developing materials for solder bump, conductive polymer and
polymer underfill in response to demands of designers and process engineers
who need these for their new high density product development. These
challenges coupled with the drive toward environmentally conscious approach
toward electronics manufacturing make these exciting times.
 
 
    Call for Abstracts
Abstracts are requested in the following areas:
 
Soldering in the Post-CFC Era
Fine-pitch and Ultra-fine Pitch Assembly
Assembly Processes for BGA and Direct Chip Attach
New Materials for BGA and Direct Chip Attach
Test Methods for Materials Reliability
    Including Surface Insulation Resistance, Electrochemical Migration,
    Corrosion Measurements, etc.
Environmentally Friendly Materials and Processes
    Including Lead-free Solder Alloys, Conductive Polymers, etc.
 
 
    PROGRAM COMMITTEE
 
Prof. Laura J. Turbini      Alvin F. Schneider
Georgia Institute of Technology     Alpha Metals
Chairman
 
David Bergman                   Tom Fujikawa
IPC                         Malcolm Instruments
 
Kathi Johnson                   Dr. Wallace Rubin
Hexacon Electric                    International Consultant
 
 
    CONFERENCE SPONSORS
 
IPC
 
School of Materials Science and Engineering
Georgia Institute of Technology
 
 
ABSTRACTS DUE:      February 1, 1996
ABSTRACTS ACCEPTANCE:   March 1, 1996
FULL PAPERS DUE:        April 19, 1996
 
SUBMIT ABSTRACTS TO:
International Conference on Electronic Assembly
Professor Laura J. Turbini
Materials Science and Engineering
778 Atlantic Drive
Atlanta, Georgia 30332-0245
(404)894-9140 FAX
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    ABSTRACT INFORMATION
 
Title
 
Author(s)
200 - 300 word abstract
Principal Author:
 
Name
Title
Company
Address
City
State/Province
Postal Code
Telephone
FAX
e-mail