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1995

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From:
[log in to unmask] (JOHN GULLEY)
Date:
Mon, 20 Nov 1995 14:26:02 -0800
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     FYI


______________________________ Forward Header __________________________________
Subject: Laminates and Prepregs
Author:  JOHN GULLEY at HICAM-HDQ-OK
Date:    11/20/95 10:11 AM


     Address,
     
     Can anyone supply technical laymen information on Speed Ball and 
     Polyimide Laminates.  I would also appreciate any test data (e.g. 
     thermal, humidity, solder, tensile strength tests) that have been 
     performed to prove the long reliability of these materials.  A 
     material characteristics sheet is also helpful.  Thank you.
     
     John Gulley - PCB Project Coordinator 
     Hitachi Computer Products Division
     1800 East Imhoff Rd
     Norman, OK 73071
     
     [log in to unmask]
     405-360-5500 x634



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