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1995

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Subject:
From:
"dmitchel" <[log in to unmask]>
Date:
Wed, 15 Nov 95 12:34:16 PST
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 Based on the temperature rise times, hot oil reflow should be less 
 stressful than HASL. 


______________________________ Reply Separator _________________________________
Subject: HASL vs. Hot Oil Reflow
Author:  [log in to unmask] at corp
Date:    11/15/95 11:42 AM


I am interested in receiving data/information comparing the thermal 
stress on boards during  the SMOBC/HASL process versus Selective 
Strip/Hot Oil Reflow Process. Especially in regards to boards over .125 
thick. 
 
Also thoughts on whether one process is less streesful than the other. 
 



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