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From: | "Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
Date: | Thu, 25 May 95 11:55:01 -0400 |
Content-Type: | text/plain |
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We are considering replacing our present pick and place machine (10 yrs old)
with a modern system. My management is concerned that whatever we purchase
today might be obsolete in 3-5 years. The system which I have in mind has the
capability of placing 15 mil pitch leaded components, 0402s, and BGAs, pretty
much the latest technologies.
My question is this, does anyone have a grasp on where component trends are
leading? Is component packaging going to be smaller still (than 0402s) or a
different technology altogether which will render my state-of-the-art placement
system obsolete? What does the future hold for components and placement
systems?
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