The appearance of the palladium plated lead IC solder joints continues 
     to create anxieties with our customers.  This occurs because they see 
     a solder connection profile which is different than would result from 
     a pb/sn plated lead connection.  Texas Instruments has published a 
     booklet demonstrating and discussing the differences, but this is not 
     completely sufficient to convince some of our customers.  
     
     Is there any 'work in progress' material available from IPC and/or 
     other sources which can be used to graphically educate auditors and 
     customers about acceptable appearances of palladium plated lead solder 
     joints?  Now our auditors and customers reference the IPC-A-610 Rev. B 
     manual.
     
     
     Thank you.
     Myron Papiz
     MSL