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1995

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Subject:
From:
[log in to unmask] (Brian R Oatman)
Date:
Sun, 15 Oct 1995 08:43:12 -0700
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I recently heard reference to a lamination press cycle for multilayer PCB's 
as a burp cycle.  This cycle is intended to help with air entrapment I believe.

If anybody has any specifics on this cycle and or results of if it works or 
not I would appreciate any and all feedback.

Thanx in advance.

brian



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