Does anyone know of good references for determining the maximum 
     current carrying capacity of traces of different trace widths and 
     copper weights.  I've seen the tables in IPC-D-275, but am looking for 
     more extensive information.  I'm also interested in knowing if there 
     are empirical equations describing max current.
     
     Additionally I need to know the same information for vias.  For a 
     given hole size and minimum plating thickness what is the maximum 
     current carrying capacity of a via.  Is this affected by the use of 
     thermals on power and ground layers.  Is this affected by whether the 
     via is bare copper, HASL coated, or solder filled?
     
     I'd appreciate any inputs?
     
     Thanks,
     
     Thad McMillan
     Dell Computer
     
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     Ph # 512-728-5240