I'm searching for information regarding the plating of laser 
     drilled 6ml vias in multifunctional epoxy on aramid non woven 
     reinforcement. We have a design of a 6 layer board, .020-.025 
     overall thickness. Core thickness is .0035, prepreg is .002.
     The problem is getting reliable plating into the vias which 
     go from layers 1 to 3 and 1 to 4. Is there currently proven 
     technology out there which can reliably perform this 
     function?
     I would appreciate information from Fabricators or OEM's who 
     are currently working within these areas.
     
     Dan Hickey
     Vicor Corporation
     508-749-3559
     fax 749-3565