A little more feedback would be:

          At 1.5.1.2 I would add....chemical properties of some clad
          innerlayer laminar bonds degrade with excessive baking of
          laminates.
          1.5.2....Generally, full cure of the initial core laminate
          is done....    (And)  .....shipment to printed board
          fabricators. Full cure of composite multilayer PCB is done
          by the fabricator based on the laminate vendor's
          recommendation for correct....
          (Under Tg testing)
          ....If the second test differs significantly (Typically any
          findings >4'C indicate under cure),......
          1.5.3....various constituents of the laminate coupled with
          the material manufacturing process.
          (Under resin type)
              I don't see some of these Tg values correspond to the
          material (all) available. Maybe a range would be a more
          representable approach. ie, Multifunctional Epoxy 140 -
          150'C, High Temp Multifunctional Epoxy 160 - 180'C, etc.
          Also the 220'C Polyimide probably should be pulled out
          separate as a Polyimide Blend at 220'C.
          The listed bake times are becoming more static because the
          laminate vendors are formulating higher Tg's with quicker
          cure times.
          As far as baking fully assembled PWAs, I always recommend
          15 minutes per layer at 220 - 230'F. This assures that high
          layer count product receives ample time to drive off any
          absorbed moisture. Higher layer count also has contains more
          resin than fiberglass which traps, retains, and is harder to
          remove than a double sided product. Also, the temperature is
          high enough to remove moisture yet low enough to not destroy
          most components.
          Dave Hoover
          Senior Process Engineer/Hadco Corp. TCII
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