REGARDING              BGA & CGA Licensing

We are an OEM considering the use of ceramic Ball Grid Array (BGA) and/or Column Grid Array (CGA) packaging technology in our aerospace systems.  If we use the JEDEC standard packages, do we need to be concerned with licensing this technology?  
We expect that any license arrangements would be applied between the BGA/CGA patent holder and the chip foundry or package house.  That would allow us to apply BGA/CGA patterns onto our PWB lay-outs and procure the corresponding already packaged components from the licenced supplier - hassle free.
Is that correct?
If we have to license the technology in order to design it into our products, then we will probably turn to other packaging  and board design methods.
Thanks,
Ken