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1995

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Subject:
Re: Immersion gold
From:
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Date:
Thu, 14 Sep 1995 21:15:10 -0400
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There are rumors of a study done by HP Fort Collins which showed that
immersion Gold with thicknesses of .000003-5" (three to five millionths) did
not create enbrittlement. 

The study assumed the assembly process being used at HP-Fort Collins, which
is no-clean, and their amount of solder paste which they applied.  Also, that
thickness of gold over nickel may even be cheaper than HASL tin-lead, but I
don't know.

George Franck
E-Systems, Virginia

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