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1995

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Subject:
C4 DIE ATTACH
From:
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc>
Date:
Tue, 12 Sep 95 12:29:01 -0400
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text/plain (13 lines) 
    Could anyone explain in layman's terms the C4 (controlled collapse chip 
    connection) method of die attachment?  I'm trying to get a better 
    understanding of the process, alloy, etc.  Also, when is this method 
    preferred over wire bonding?
    
    Thanks in advance,
    
    Jim Marsico
    AIL Systems, Inc.
    Deer Park, NY

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